DS90CF366 Datasheet, PDF (14/20 Pages) Texas Instruments – 20 to 85 MHz Shift Clock Support, Rx Power Consumption <142 mW (typ) @85MHz Grayscale

PACKAGE OPTION ADDENDUM
www.ti.com
21-Apr-2013
PACKAGING INFORMATION
Orderable Device
DS90CF366MTD/NOPB
DS90CF366MTDX/NOPB
DS90CF386MTD
DS90CF386MTD/NOPB
DS90CF386MTDX/NOPB
DS90CF386SLC/NOPB
DS90CF386SLCX/NOPB
Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C)
(1)
Drawing
Qty
(2)
(3)
ACTIVE TSSOP
DGG 48
38 Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR -10 to 70
ACTIVE TSSOP
DGG 48 1000 Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR -10 to 70
ACTIVE TSSOP
DGG 56
34
TBD
Call TI
Call TI
-10 to 70
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
NFBGA
DGG 56
34 Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR -10 to 70
DGG 56 1000 Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR -10 to 70
NZC 64 360 Green (RoHS POST-PLATE Level-4-260C-72 HR -10 to 70
& no Sb/Br)
ACTIVE NFBGA
NZC
64 2000 Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-260C-72 HR -10 to 70
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Top-Side Markings
(4)
DS90CF366MTD
>B
DS90CF366MTD
>B
DS90CF386MTD
>B
DS90CF386MTD
>B
DS90CF386MTD
>B
DS90CF386
SLC
>B
DS90CF386
SLC
>B
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
Samples
Addendum-Page 1