SI7252DP Datasheet, PDF (1/13 Pages) Vishay Siliconix – Dual N-Channel 100 V (D-S) MOSFET

New Product
Si7252DP
Vishay Siliconix
Dual N-Channel 100 V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
R_DS(on) () Max.
0.017 at V_GS = 10 V
100
0.018 at V_GS = 7.5 V
0.020 at V_GS = 6 V
I_D (A)^a
36.7
35.7
33.9
Q_g (Typ.)
12.2 nC
PowerPAK SO-8
6.15 mm
D1
8
D1
7
D2
6
D2
5
S1
1
G1
2
5.15 mm
S2
3
G2
4
Bottom View
Ordering Information:
Si7252DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• TrenchFET^® Power MOSFET
• 100 % R_g and UIS Tested
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
• Primary Side Switching
• Synchronous Rectification
• DC/AC Inverters
D₁
D₂
G₁
N-Channel MOSFET
S₁
G₂
N-Channel MOSFET
S₂
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
100
V
V_GS
± 20
T_C = 25 °C
36.7
Continuous Drain Current (T_J = 150 °C)
T_C = 85 °C
T_A = 25 °C
I_D
29.2
10.1^{b, c}
T_A = 85 °C
8^{b, c}
A
Pulsed Drain Current (t = 300 µs)
I_DM
80
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
38
2.9^{b, c}
Single Pulse Avalanche Current
L = 0.1 mH
I_AS
20
Single Pulse Avalanche Energy
E_AS
20
mJ
T_C = 25 °C
46
Maximum Power Dissipation
T_C = 85 °C
T_A = 25 °C
P_D
29
3.5^{b, c}
W
T_A = 85 °C
2.2^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
t  10 s
R_thJA
26
Maximum Junction-to-Case (Drain)
Steady State
R_thJC
2.2
35
°C/W
2.7
Notes:
a. Based on T_C = 25 °C
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 85 °C/W.
Document Number: 62634
For technical questions, contact: [e-mail]
www.vishay.com
S12-2186-Rev. A, 10-Sep-12
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000