C5750X7R1H106M Datasheet, PDF (71/72 Pages) TDK Electronics – C Series General Application

Packaging
Information
• Carrier Tape Configuration
Bulk
160mm min.
Chips
C Series – General Application
Bulk
160mm min
Drawing direction
Leader
400mm min
• Peel Back Force (Top Tape)
Carrier tape
Direction & angle of pull
Top cover tape
0.05 – 0.7 N
0~15°
• Carrier tape shall be flexible enough to be
wound around a minimum radius of 30mm with
components in tape.
• The missing of components shall be less than
0.1%
• Components shall not stick to the cover tape.
• The cover tape shall not protrude beyond the
edges of the carrier tape not shall cover the
sprocket holes.
• Chip Quantity Per Reel and Structure of Reel (Paper & Plastic)
Paper Carrier Tape & Reel
Top cover tape
Pitch hole
Bottom cover tape
Paper carrier tape
Plastic Carrier Tape & Reel
Top cover tape
Pitch hole
Plastic carrier tape
Case Code
JIS
EIA
C0402 CC01005
C0603 CC0201
C1005 CC0402
C1608 CC0603
C2012 CC0805
C3216 CC1206
C3225 CC1210
C4532 CC1812
C5750 CC2220
Chip
Thickness
0.20 mm
0.30 mm
0.50 mm
0.80 mm
0.60 mm
0.85 mm
1.25 mm
0.60 mm
0.85 mm
1.15 mm
1.30 mm
1.60 mm
1.15 mm
1.25 mm
1.30 mm
1.60 mm
2.00 mm
2.30 mm
2.50 mm
1.60 mm
2.00 mm
2.30 mm
2.50 mm
2.80 mm
3.20 mm
2.00 mm
2.30 mm
2.50 mm
2.80 mm
Taping
Material
Paper
Paper
Paper
Paper
Paper/Plastic
Plastic
Paper
Paper/Plastic
Plastic
Plastic
Plastic
Plastic
Chip quantity (pcs.)
φ178mm (7”) reel φ330mm (13”) reel
20,000
-
15,000
-
10,000
50,000
4,000
10,000
4,000
20,000
2,000
10,000
4,000
10,000
2,000
2,000
8,000
10,000
2,000
8,000
1,000
1,000
500
500
5,000
3,000
2,000
3,000
2,000
TDK MLCC US Catalog
Page 73
Version B11