C5750X7R1H106M Datasheet, PDF (69/72 Pages) TDK Electronics – C Series General Application

General
Specifications
Appendix - 1a
P.C. Board for reliability test
Applied for C0603, C1005, C1608, C2012, C3216
c
100 mm
C Series – General Application
Appendix - 1b
P.C. Board for reliability test
Applied for C3225, C4532, C5750
c
100 mm
Solder Resist
Copper
Appendix - 2a
P.C. Board for bending test
Applied for C0603, C1005
100 mm
b
Slit
Solder Resist
Copper
Appendix - 2b
P.C. Board for bending test
Applied for C1608, C2012, C3216, C3225, C4532, C5750
100 mm
b
a
Solder resist
a
c
b
Copper
Material: Glass Epoxy (As per JIS C6484 GE4)
P.C. Board thickness: Appendix-2a
0.8mm
Appendix-1a, 1b, 2b 1.6mm
Copper (thickness 0.035mm)
Solder resist
Solder Resist
Copper
Case Code
JIS
EIA
C0603
CC0201
C1005
CC0402
C1608
CC0603
C2012
CC0805
C3216
CC1206
C3225
CC1210
C4532
CC1812
C5750
CC2220
Dimensions (mm)
a
b
c
0.3
0.8
0.3
0.4
1.5
0.5
1.0
3.0
1.2
1.2
4.0
1.65
2.2
5.0
2.0
2.2
5.0
2.9
3.5
7.0
3.7
4.5
8.0
5.6
TDK MLCC US Catalog
Page 71
Version B11