CGA5L2X8R1E105KTXXXX Datasheet, PDF (34/36 Pages) TDK Electronics – Automotive Grade Capacitors

Soldering
Information
CGA Series – Automotive Grade Capacitors
• Recommended Soldering Land Pattern
Chip capacitor
Solder land
• Recommended Soldering Profile
Wave Soldering
Soldering
Preheating
Natural
cooling
Reflow Soldering
Preheating
Soldering
Natural
cooling
C
PTeemakp
PTeemakp
△T
∆T
B
A
Solder resist
Wave Soldering
Type ^CGA3
Symbol
[CC0603]
A
0.7 - 1.0
B
0.8 - 1.0
C
0.6 - 0.8
CGA4
[CC0805]
1.0 - 1.3
1.0 - 1.2
0.8 - 1.1
Unit: mm
CGA5
[CC1206]
2.1 - 2.5
1.1 - 1.3
1.0 - 1.3
Reflow Soldering
Type ^CGA2
Symbol
[CC0402]
A
0.3 - 0.5
B
0.35 - 0.45
C
0.4 - 0.6
CGA3
[CC0603]
0.6 - 0.8
0.6 - 0.8
0.6 - 0.8
Unit: mm
CGA4
[CC0805]
0.9 - 1.2
0.7 - 0.9
0.9 - 1.2
Reflow Soldering
Type ^CGA5
Symbol
[CC1206]
A
2.0 - 2.4
B
1.0 - 1.2
C
1.1 - 1.6
Unit: mm
CGA6
[CC1210]
2.0 - 2.4
1.0 - 1.2
1.9 - 2.5
• Recommended Solder Amount
Excessive
solder
Higher tensile
force on the chip
capacitor may
cause cracking.
Adequate
solder
Maximum amount
Minimum amount
Insufficient
solder
Small solder fillet
may cause
contact failure or
failure to hold the
chip capacitor to
the P.C. board.
0
Over 60 sec.
Over 60 sec.
Peak Temp time
Manual soldering
(Solder iron)
300
∆T
0
Over 60 sec.
Peak Temp time
0
Preheating
3sec. (As short as possible)
Recommended soldering duration
Solder
Temp./
Dura.
Sn-Pb
Solder
Lead-Free
Solder
Wave Soldering
Peak temp
(°C)
Duration
(sec.)
250 max.
3 max.
260 max.
5 max.
Recommended solder compositions
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Reflow Soldering
Peak temp
(°C)
Duration
(sec.)
230 max.
20 max.
260 max.
10 max.
Preheating Condition
Soldering
Wave
soldering
Reflow
soldering
Manual
soldering
Case Size - JIS (EIA)
CGA3(CC0603), CGA4(CC0805),
CGA5(CC1206)
CGA2(CC0402), CGA3(CC0603),
CGA4(CC0805), CGA5(CC1206)
CGA6(CC1210)
CGA2(CC0402), CGA3(CC0603),
CGA4(CC0805), CGA5(CC1206)
CGA6(CC1210)
Temp. (ºC)
∆T ≤ 150
∆T ≤ 150
∆T ≤ 130
∆T ≤ 150
∆T ≤ 130
TDK MLCC US Catalog
Page 322
Version B11