STAP85025S Datasheet, PDF (9/13 Pages) STMicroelectronics – RF power transistor, LdmoST plastic family N-channel enhancement-mode lateral MOSFETs

STAP85025S
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Mounting recommendations
Mounting recommendations
The STAP® product family, comprising a combination of the ubiquitous PowerSO-10™
package and a smartly designed compression clamp, provides a system to achieve superior
electro-mechanical contact between the PowerSO-10 heat slug and a heatsink in traditional
bolt-down applications where through-the-board mounting and removal procedures are
required. The clamp is bonded to the PowerSO-10 package with a formulated epoxy. The
STAP® family is not recommended and should not be considered as a stand-alone package
for surface mount soldering applications.
Mounting recommendations are available on www.st.com (see application note AN3232).
DocID15795 Rev 5
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