ESDAULC6-3BP6 Datasheet, PDF (9/11 Pages) STMicroelectronics – ESD protection for high speed interface

ESDAULC6-3BP6, ESDAULC6-3BF2
Figure 25. Flip-Chip dimensions
500 µm ± 50
Package information
650 µm ± 65
1.1 mm ± 50 µm 315 µm ± 50
Figure 26. Flip-Chip footprint
Copper pad Diameter:
220 µm recommended
Solder stencil opening:
330 µmrecommended
Solder mask opening recommendation:
300 µmrecommended
Figure 27. Flip-Chip marking
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
E
xxz
y _ww
Figure 28. Flip-Chip tape and reel specifications
Dot identifying Pin A1 location
4 +/- 0.1
Ø 1.5 +/- 0.1
0.71 +/- 0.05
4 +/- 0.1
All dimensions in mm
User direction of unreeling
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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