ESDAULC6-3BP6 Datasheet, PDF (1/11 Pages) STMicroelectronics – ESD protection for high speed interface

ESDAULC6-3BP6
ESDAULC6-3BF2
ESD protection for high speed interface
Main applications
Where transient overvoltage protection in ESD
sensitive equipment is required, such as:
■ Computers
■ Printers
■ Communication systems
■ Cellular phones handsets and accessories
■ Video equipment
Features
■ Ultra low capacitance 1.25 pF max.
■ Bi-directional protection
■ RoHS package
Description
The ESDAULC6-3Bxx is a monolithic application
specific discrete device dedicated to ESD
protection of high speed interfaces such as
USB2.0.
The device is ideal for applications where both
reduced print circuit board space and power
absorption capability are required.
Benefits
■ Ultra low capacitance bidirectional ESD
protection
■ Low PCB space consumption:
2.5 mm² max footprint (1.7 mm² for Flip-Chip)
■ Enhanced ESD protection:
– 15 kV contact discharge
– 15 kV air discharge
■ No insertion loss to 3.0 GHz
■ Ultra low leakage current
■ High reliability offered by monolithic integration
SOT-666
ESDAULC6-3BP6
Flip-Chip
ESDAULC6-3BF2
Figure 1.
I/O1 1
NC 2
I/O2 ³
Functional diagram
AB
6 GND
5 NC
I/O1 GND 1
4 I/O3
I/O2 I/O3 2
Top view
ESDAULC6-3BP6
Bump side view
ESDAULC6-3BF2
Figure 2.
Pin configuration
I/O1
I/O2
I/O3
GND
Table 1. Order codes
Part number
ESDAULC6-3BP6
ESDAULC6-3BF2
Marking
3
3B
Complies with the following standards:
IEC 61000-4-2 level 4:
8 kV (contact discharge)
15 kV (air discharge)
MIL STD 883G-Method 3015-7: class 3B
HBM (Human Body Model)
July 2007
Rev 1
1/11
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