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STDLED625 Datasheet, PDF (5/18 Pages) STMicroelectronics – Gate charge minimized
STDLED625, STULED625
Electrical characteristics
Symbol
Parameter
td(on)
tr
td(off)
tf
Turn-on delay time
Rise time
Turn-off-delay time
Fall time
Table 6. Switching times
Test conditions
VDD = 310 V, ID = 2.75 A,
RG = 4.7 Ω, VGS = 10 V
(see Figure 15)
Min.
-
-
-
-
Typ.
22
12
49
20
Max. Unit
-
ns
-
ns
-
ns
-
ns
) Symbol
Table 7. Source-drain diode
Parameter
Test conditions
Min. Typ. Max. Unit
t(s ISD
uc ISDM(1)
rod VSD(2)
Source-drain current
Source-drain current (pulsed)
Forward on voltage
ISD = 5.5 A, VGS = 0
P trr
te Qrr
le IRRM
Reverse recovery time
Reverse recovery charge
Reverse recovery current
ISD = 5.5 A, di/dt = 100 A/µs
VDD = 60 V (see Figure 18)
so trr
Reverse recovery time
b Qrr Reverse recovery charge
- O IRR Reverse recovery current
ISD = 5.5 A, di/dt = 100 A/µs
VDD = 60 V, Tj = 150 °C
(see Figure 18)
) 1. Pulse width limited by safe operating area.
t(s 2. Pulsed: pulse duration = 300 µs, duty cycle 1.5%.
-
5.5 A
27 A
-
1.5 V
- 290
ns
- 1900
nC
- 13.5
A
- 335
ns
- 2400
nC
- 14.5
A
roduc Table 8. Gate-source Zener diode
P Symbol
Parameter
Test conditions
leteV(BR)GSO
Gate-source breakdown
voltage
IGS = ± 1 mA, ID = 0
Min. Typ. Max. Unit
30 -
-V
Obso The built-in back-to-back Zener diodes have been specifically designed to enhance not only
the device’s ESD capability, but also to make them capable of safely absorbing any voltage
transients that may occasionally be applied from gate to source. In this respect, the Zener
voltage is appropriate to achieve efficient and cost-effective protection of device integrity.
The integrated Zener diodes thus eliminate the need for external components.
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