LSM303DLHC Datasheet, PDF (40/43 Pages) STMicroelectronics – Ultra compact high performance e-compass 3D accelerometer and 3D magnetometer module

Package information
8
Package information
LSM303DLHC
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions, and product status are available at: www.st.com.
ECOPACK is an ST trademark.
Figure 5. LGA-14: mechanical data and package dimensions
R ef.
A1
A2
A3
D1
E1
N1
L1
T1
T2
M
k
Dimens ions
mm
Min.
Typ.
0.785
0.16
0.2
2.85
3
4.85
5
0.8
4
0.8
0.5
0.1
0.05
Max.
1
0.24
3.15
5.15
Outline and
mec hanic al data
LGA 3x5x1 14L
Land Grid Array Package
40/42
Doc ID 018771 Rev 1
8265271_A