LSM303DLHC Datasheet, PDF (10/43 Pages) STMicroelectronics – Ultra compact high performance e-compass 3D accelerometer and 3D magnetometer module

Module specifications
LSM303DLHC
Table 3. Sensor characteristics (continued)
Symbol
Parameter
Test conditions
LA_TCSo
Linear acceleration sensitivity
change vs. temperature
FS bit set to 00
LA_TyOff
LA_TCOff
Linear acceleration typical
Zero-g level offset
accuracy^(3),(4)
Linear acceleration Zero-g
level change vs. temperature
FS bit set to 00
Max. delta from 25 °C
LA_An
Acceleration noise density
FS bit set to 00, normal
mode(Table 8.), ODR bit
set to 1001
M_R
Magnetic resolution
Cross field =.0.5 gauss
M_CAS Magnetic cross-axis sensitivity
H applied = ±3 gauss
M_EF
Maximum exposed field
No permitting effect on
zero reading
M_DF
Disturbing field
Sensitivity starts to
degrade. Use S/R pulse to
restore sensitivity
Top
Operating temperature range
1. Typical specifications are not guaranteed.
2. Verified by wafer level test and measurement of initial offset and sensitivity.
3. Typical Zero-g level offset value after MSL3 preconditioning.
4. Offset can be eliminated by enabling the built-in high pass filter.
Min.
-40
Typ.⁽¹⁾
±0.01
Max.
Unit
%/°C
±60
mg
±0.5
mg/°C
ug/
220
sqrt(Hz)
2
mgauss
%FS/
±1
gauss
10000 gauss
20
gauss
+85
°C
2.2
Temperature sensor characteristics
@ Vdd = 2.5 V, T = 25 °C unless otherwise noted ^(b).
Table 4. Temperature sensor characteristics
Symbol
Parameter
Test condition
TSDr
Temperature sensor output
change vs. temperature
TODR
Temperature refresh rate
-
Top
Operating temperature range
1. Typical specifications are not guaranteed.
2. 12-bit resolution.
3. For ODR configuration refer to Table 72.
Min.
-40
Typ.⁽¹⁾
8
ODR⁽³⁾
Max.
+85
Unit
LSB/°C⁽²⁾
Hz
°C
10/42
b. The product is factory calibrated at 2.5 V.
Doc ID 018771 Rev 1