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STD9N65M2 Datasheet, PDF (4/23 Pages) STMicroelectronics – Extremely low gate charge
Electrical characteristics
STD9N65M2, STF9N65M2, STP9N65M2, STU9N65M2
2
Electrical characteristics
(TC = 25 °C unless otherwise specified)
Symbol
Parameter
Table 5. On /off states
Test conditions
V(BR)DSS
Drain-source
breakdown voltage
VGS = 0, ID = 1 mA
IDSS
IGSS
Zero gate voltage
drain current
Gate-body leakage
current
VGS = 0, VDS = 650 V
VGS = 0, VDS = 650 V,
TC=125 °C
VDS = 0, VGS = ± 25 V
VGS(th)
RDS(on)
Gate threshold voltage VDS = VGS, ID = 250 µA
Static drain-source
on-resistance
VGS = 10 V, ID = 2.5 A
Min. Typ. Max. Unit
650
V
1 µA
100 µA
±10 µA
2
3
4
V
0.79 0.9 Ω
Symbol
Parameter
Table 6. Dynamic
Test conditions
Min. Typ. Max. Unit
Ciss
Coss
Crss
Input capacitance
Output capacitance
Reverse transfer
capacitance
VDS = 100 V, f = 1 MHz,
VGS = 0
-
315
- pF
-
18
- pF
-
1
- pF
Coss
(1)
eq
Equivalent output
capacitance
VGS = 0, VDS = 0 to 520 V
-
109
- pF
RG
Intrinsic gate
resistance
f = 1 MHz open drain
-
6.6
-
Ω
Qg Total gate charge
VDD = 520 V, ID = 5 A,
Qgs Gate-source charge VGS = 10 V
Qgd Gate-drain charge
(see Figure 19)
-
10
- nC
-
2.5
- nC
-
5
- nC
1. Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80%
VDSS
Symbol
Parameter
td(on)
tr
td(off)
tf
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Table 7. Switching times
Test conditions
VDD = 325 V, ID = 2.5 A,
RG = 4.7 Ω, VGS = 10 V
(see Figure 18 and Figure 23)
Min.
-
-
-
-
Typ.
7.5
6.6
22.5
18
Max. Unit
-
ns
-
ns
-
ns
-
ns
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