M34E04B Datasheet, PDF (30/35 Pages) STMicroelectronics – 4-Kbit Serial Presence Detect EEPROM compatible

Package information
8
Package information
M34E04B
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK^®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK^® is an ST trademark.
8.1
UFDFN8 package information
Figure 14. UFDFN8 - 8-lead, 2 × 3 mm, 0.5 mm pitch ultra thin profile fine pitch
dual flat package outline
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1. Max. package warpage is 0.05 mm.
2. Exposed copper is not systematic and can appear partially or totally according to the cross section.
3. Drawing is not to scale.
4. The central pad (the area E2 by D2 in the above illustration) must be either connected to Vss or left floating
(not connected) in the end application
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DocID028428 Rev 1