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STD13NM60ND Datasheet, PDF (3/21 Pages) STMicroelectronics – N-channel 600 V, 0.32 typ., 11 A, FDmesh II Power MOSFET (with fast diode) in DPAK
STD13NM60ND, STF13NM60ND, STP13NM60ND
1
Electrical ratings
Electrical ratings
Symbol
Table 2. Absolute maximum ratings
Parameter
Value
Unit
DPAK, TO-220 TO-220FP
VDS Drain-source voltage
VGS Gate-source voltage
ID Drain current (continuous) at TC = 25°C
ID Drain current (continuous) at TC = 100°C
(2)
IDM
Drain current (pulsed)
PTOT Total dissipation at TC = 25°C
(3)
dv/dt Peak diode recovery voltage slope
(4)
dv/dt MOSFET dv/dt ruggedness
600
± 25
11
6.93
44
109
40
40
(1)
11
(1)
6.93
(1)
44
25
VISO
Insulation withstand voltage (RMS) from all
three leads to external heat sink
(t=1s;TC=25°C)
2500
Tstg Storage temperature
-55 to 150
Tj Max. operating junction temperature
150
1. Limited by maximum junction temperature
2. Pulse width limited by safe operating area
3. ISD ≤ 11 A, di/dt ≤ 400 A/μs, VDD = 80% V(BR)DSS, VDS(peak) ≤ V(BR)DSS
4. VDS ≤ 480 V
V
V
A
A
A
W
V/ns
V/ns
V
°C
°C
Symbol
Table 3. Thermal data
Parameter
Value
Unit
DPAK TO-220FP TO-220
Rthj-case Thermal resistance junction-case max
Rthj-amb Thermal resistance junction-amb max
(1)
Rthj-pcb Thermal resistance junction-pcb max
1. When mounted on 1inch² FR-4 board, 2 oz Cu
1.15
5
1.15 °C/W
62.5
°C/W
50
°C/W
Symbol
Table 4. Avalanche characteristics
Parameter
Max value
Avalanche current, repetitive or not-
IAS
(1)
3
repetitive
EAS
(2)
Single pulse avalanche energy
162
1. Pulse width limited by Tj max
2. starting Tj= 25 °C, ID=IAS, VDD= 50 V
DocID024645 Rev 1
Unit
A
mJ
3/21