STM32F722XX Datasheet, PDF (220/229 Pages) –

Package information
STM32F722xx STM32F723xx
UFBGA176+25 device marking
The following figure gives an example of topside marking orientation versus ball A1 identifier
location.
Other optional marking or inset/upset marks, which identify the parts throughout supply
chain operations, are not indicated below.
Figure 96. UFBGA176+25, 10 × 10 × 0.6 mm ultra thin fine-pitch ball grid array
package top view example
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1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
samples to run qualification activity.
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