STM32L433XX Datasheet, PDF (207/225 Pages) STMicroelectronics – Ultra-low-power Arm® Cortex®-M4 32-bit MCU+FPU, 100DMIPS, up to 256KB Flash, 64KB SRAM, USB FS, LCD, ext. SMPS

STM32L433xx
Package information
Table 108. WLCSP64 - 64-ball, 3.141 x 3.127 mm, 0.35 mm pitch wafer level chip scale
package mechanical data (continued)
Symbol
millimeters
Min
Typ
Max
inches⁽¹⁾
Min
Typ
Max
b⁽³⁾
0.190
0.220
0.250
0.0075
0.0087
0.0098
D
3.106
3.141
3.176
0.1223
0.1237
0.1250
E
3.092
3.127
3.162
0.1217
0.1231
0.1245
e
-
0.350
-
-
0.0138
-
e1
-
2.450
-
-
0.0965
-
e2
-
2.450
-
-
0.0965
-
F
-
0.3455
-
-
0.0136
-
G
-
0.3385
-
-
0.0133
-
aaa
-
-
0.100
-
-
0.0039
bbb
-
-
0.100
-
-
0.0039
ccc
-
-
0.100
-
-
0.0039
ddd
-
-
0.050
-
-
0.0020
eee
-
-
0.050
-
-
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Back side coating.
3. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
Figure 55. WLCSP64 - 64-ball, 3.141 x 3.127 mm, 0.35 mm pitch wafer level chip scale
package recommended footprint
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'VP
:/&63B$=B)3B9
Table 109. WLCSP64 recommended PCB design rules (0.35 mm pitch)
Dimension
Recommended values
Pitch
0.35 mm
Dpad
Dsm
0.210 mm
0.275 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening
Stencil thickness
0.235 mm
0.100 mm
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