STM32L433XX Datasheet, PDF (167/225 Pages) STMicroelectronics – Ultra-low-power Arm® Cortex®-M4 32-bit MCU+FPU, 100DMIPS, up to 256KB Flash, 64KB SRAM, USB FS, LCD, ext. SMPS

STM32L433xx
Electrical characteristics
Table 81. DAC characteristics⁽¹⁾ (continued)
Symbol
Parameter
Conditions
Min Typ
Max Unit
T_{W_to_W}
Minimal time between two
consecutive writes into the
DAC_DORx register to
guarantee a correct
DAC_OUT for a small
variation of the input code
(1 LSB)
DAC_MCR:MODEx[2:0] =
000 or 001
DAC_MCR:MODEx[2:0] =
010 or 011
CL ≤ 50 pF, RL ≥ 5 kΩ
CL ≤ 10 pF
-
1
1.4
DAC_OUT
DAC output buffer
ON, C_SH = 100 nF
-
0.7
Sampling time in sample
and hold mode (code
transition between the
pin connected _{DAC output buffer}
OFF, C_SH = 100 nF
-
10.5
t_SAMP
lowest input code and the DAC_OUT
highest input code when pin not
DACOUT reaches final
value ±1LSB)
connected
(internal
DAC output buffer
OFF
-
2
connection
only)
-
µs
3.5
ms
18
3.5
µs
I_leak
Output leakage current
Sample and hold mode,
DAC_OUT pin connected
-
-
-⁽³⁾
nA
CI_int
Internal sample and hold
capacitor
-
5.2
7
8.8
pF
t_TRIM
Middle code offset trim
time
DAC output buffer ON
50
-
-
µs
V_offset
Middle code offset for 1
trim code step
V_REF+ = 3.6 V
V_REF+ = 1.8 V
-
-
DAC output
No load, middle
code (0x800)
-
buffer ON
No load, worst code
(0xF1C)
-
I_DDA(DAC)
DAC consumption from
V_DDA
DAC output No load, middle
buffer OFF code (0x800)
-
1500
750
315
450
-
-
µV
-
500
670
0.2
µA
Sample and hold mode, C_SH =
100 nF
315 ₓ 670 ₓ
-
Ton/(Ton Ton/(Ton
+Toff) +Toff)
(4)
(4)
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