STM32F756VG Datasheet, PDF (202/228 Pages) STMicroelectronics – Up to 25 communication interfaces

Package information
STM32F756xx
Table 114. TFBGA100 recommended PCB design rules (0.8 mm pitch BGA)
Dimension
Recommended values
Pitch
0.8
Dpad
Dsm
0.400 mm
0.470 mm typ (depends on the soldermask
registration tolerance)
Stencil opening
Stencil thickness
Pad trace width
0.400 mm
Between 0.100 mm and 0.125 mm
0.120 mm
Marking of engineering samples
The following figure gives an example of topside marking orientation versus ball A1 identifier
location.
Figure 84. TFBGA100, 8 × 8 × 0.8mm thin fine-pitch ball grid array package
top view example
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1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
samples to run qualification activity.
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