STM32F413XG Datasheet, PDF (197/207 Pages) STMicroelectronics – ARM-Cortex-M4 32b MCU+FPU, 125 DMIPS, up to 1.5MB Flash, 320KB RAM, USB OTG FS, 1 ADC, 2 DACs, 2 DFSDMs

STM32F413xG/H
Package information
Table 110. UFBGA144 - 144-ball, 10 x 10 mm, 0.80 mm pitch, ultra fine pitch ball grid
array package mechanical data (continued)
Symbol
Min.
millimeters
Typ.
Max.
Min.
inches⁽¹⁾
Typ.
Max.
F
0.550
0.600
0.650
0.0177
0.0197
0.0217
ddd
-
-
0.080
-
-
0.0039
eee
-
-
0.150
-
-
0.0059
fff
-
-
0.080
-
-
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Figure 82. UFBGA144 - 144-pin, 10 x 10 mm, 0.80 mm pitch, ultra fine pitch ball
grid array recommended footprint
'SDG
'VP
Note:
ϬϮzͺ&Wͺsϭ
Table 111. UFBGA144 recommended PCB design rules (0.80 mm pitch BGA)
Dimension
Recommended values
Pitch
Dpad
0.80 mm
0.400 mm
Dsm
0.550 mm typ. (depends on the soldermask
registration tolerance)
Non solder mask defined (NSMD) pads are recommended.
4 to 6 mils solder paste screen printing process.
Stencil opening is 0.400 mm.
Stencil thickness is between 0.100 mm and 0.125 mm.
Pad trace width is 0.120 mm.
DocID029162 Rev 2
197/207
205