STM32F413XG Datasheet, PDF (151/207 Pages) STMicroelectronics – ARM-Cortex-M4 32b MCU+FPU, 125 DMIPS, up to 1.5MB Flash, 320KB RAM, USB OTG FS, 1 ADC, 2 DACs, 2 DFSDMs

STM32F413xG/H
Electrical characteristics
6.3.22 V_BAT monitoring characteristics
Symbol
Table 82. V_BAT monitoring characteristics
Parameter
Min
Typ
R
Q
Er⁽¹⁾
T_{S_vbat(2)(2)}
Resistor bridge for V_BAT
Ratio on V_BAT measurement
Error on Q
ADC sampling time when reading the V_BAT
1 mV accuracy
-
50
-
4
–1
-
5
-
1. Guaranteed by design.
2. Shortest sampling time can be determined in the application by multiple iterations.
Max
-
-
+1
-
Unit
KΩ
%
µs
6.3.23 Embedded reference voltage
The parameters given in Table 83 are derived from tests performed under ambient
temperature and V_DD supply voltage conditions summarized in Table 16.
Table 83. Embedded internal reference voltage
Symbol
Parameter
Conditions
Min _Typ Max Unit
V_REFINT
T_{S_vrefint(1)}
Internal reference voltage
ADC sampling time when reading the
internal reference voltage
–40 °C < T_A < +125 °C
-
V_{RERINT_s(2)}
Internal reference voltage spread over the
temperature range
T_Coeff(2)
t_START(2)
Temperature coefficient
Startup time
V_DD = 3V ± 10mV
-
-
1. Shortest sampling time can be determined in the application by multiple iterations.
2. Guaranteed by design
1.18
10
-
-
-
1.21
-
3
30
6
1.24
V
-
µs
5
mV
50 ppm/°C
10
µs
Table 84. Internal reference voltage calibration values
Symbol
Parameter
Memory address
V_{REFIN_CAL}
Raw data acquired at temperature of
30 °C V_DDA = 3.3 V
0x1FFF 7A2A - 0x1FFF 7A2B
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