STM32F413XG Datasheet, PDF (179/207 Pages) STMicroelectronics – ARM-Cortex-M4 32b MCU+FPU, 125 DMIPS, up to 1.5MB Flash, 320KB RAM, USB OTG FS, 1 ADC, 2 DACs, 2 DFSDMs

STM32F413xG/H
Package information
7.2
UFQFPN48 package information
Figure 66. UFQFPN48 - 48-lead, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat
package outline
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1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and
solder this back-side pad to PCB ground.
DocID029162 Rev 2
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