STM32F446XC Datasheet, PDF (193/202 Pages) STMicroelectronics – ARM Cortex-M4 32b MCU+FPU, 225DMIPS, up to 512kB Flash/128+4KB RAM, USB OTG HS/FS, 17 TIMs, 3 ADCs, 20 comm. interfaces

STM32F446xC/E
Package information
Table 115. WLCSP81- 81-pin, 3.693 x 3.815 mm, 0.4 mm pitch wafer level chip scale
package mechanical data (continued)
Symbol
millimeters
Min
Typ
Max
inches⁽¹⁾
Min
Typ
Max
F
-
0.2465
-
-
0.0097
-
G
-
0.3075
-
-
0.0121
-
aaa
-
-
0.100
-
-
0.0039
bbb
-
-
0.100
-
-
0.0039
ccc
-
-
0.100
-
-
0.0039
ddd
-
-
0.050
-
-
0.0020
eee
-
-
0.050
-
-
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Back side coating
3. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
Figure 83. WLCSP81- 81-pin, 4.4084 x 3.7594 mm, 0.4 mm pitch wafer level chip scale
package recommended footprint
'SDG
'VP
$7B)3B9
Table 116. WLCSP81 recommended PCB design rules (0.4 mm pitch)
Dimension
Recommended values
Pitch
Dpad
Dsm
Stencil opening
Stencil thickness
0.4 mm
0.225 mm
0.290 mm typ. (depends on the soldermask
registration tolerance)
0.250 mm
0.100 mm
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