STM32F303RD Datasheet, PDF (167/184 Pages) STMicroelectronics – Reset and supply management

STM32F303xD STM32F303xE
Package information
Table 92. UFBGA100 - 100-pin, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array
package mechanical data (continued)
Symbol
Min.
millimeters
Typ.
Max.
Min.
inches⁽¹⁾
Typ.
Max.
ddd
-
eee
-
fff
-
-
0.100
-
-
0.150
-
-
0.050
-
-
0.0039
-
0.0059
-
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Figure 58. UFBGA100 - 100-pin, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid
array recommended footprint
Note:
Note:
'SDG
'VP
069
Table 93. UFBGA100 recommended PCB design rules (0.5 mm pitch BGA)
Dimension
Recommended values
Pitch
0.5
Dpad
0.27 mm
Dsm
0.35 mm typ. (depends on the soldermask
registration tolerance)
Solder paste
0.27 mm aperture diameter.
Non-solder mask defined (NSMD) pads are recommended.
4 to 6 mils solder paste screen printing process.
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