E-L6205PD Datasheet, PDF (16/21 Pages) STMicroelectronics – DMOS DUAL FULL BRIDGE DRIVER

L6205
Figure 17. Mounting the PowerSO package.
Slug soldered
to PCB with
dissipating area
Slug soldered
to PCB with
dissipating area
plus ground layer
Slug soldered to PCB with
dissipating area plus ground layer
contacted through via holes
Figure 18. PowerSO20 Junction-Ambient thermal resistance versus on-board copper area.
ºC / W
43
38
33
W ith o ut G ro u nd La yer
28
W ith Gro un d La yer
W ith Gro un d La yer+ 16 via
23
H o le s
On-Board Copper Area
18
13
1 2 3 4 5 6 7 8 9 10 1 1 1 2 13
sq. cm
Figure 19. PowerDIP20 Junction-Ambient thermal resistance versus on-board copper area.
ºC / W
42
41
Copper Area is on Bottom Side
40
39
Copper Area is on Top Side
38
37
36
35
34
33
1 2 3 4 5 6 7 8 9 10 11 12
s q. cm
On-Board Copper Area
Figure 20. SO20 Junction-Ambient thermal resistance versus on-board copper area.
ºC / W
68
On-Board Copper Area
66
64
62
60
C o pp er A re a is o n T op S id e
58
56
54
52
50
48
1 2 3 4 5 6 7 8 9 10 11 12
s q. cm
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