STCD1020_10 Datasheet, PDF (15/40 Pages) STMicroelectronics – Multichannel clock distribution circuit

STCD1020, STCD1030, STCD1040
5
Maximum ratings
Maximum ratings
Stressing the device above the rating listed in the absolute maximum ratings table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Table 4. Absolute maximum ratings (1.8 V supply)
Symbol
Parameter
Value
T_STG
T_SLD(1)
T_J
V_CC
V_IN
V_EN
θ_JA
Storage temperature (V_CC off)
Lead solder temperature for 10 seconds
Maximum junction temperature
Supply voltage
Input voltage level
Voltage on enable pins
Thermal resistance (junction to ambient)
TDFN8
TDFN10
TDFN12
–55 to 150
260
150
–0.3 to 3.6
–0.3 to 3.6
–0.3 to 3.6
149.0
136.6
132.4
1. Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds.
Unit
°C
°C
°C
V
V
V
°C/W
°C/W
°C/W
Table 5. Absolute maximum ratings (2.8 V supply)
Symbol
Parameter
Value
T_STG
T_SLD(1)
T_J
V_CC
V_IN
V_EN
Storage temperature (V_CC off)
Lead solder temperature for 10 seconds
Maximum junction temperature
Supply voltage
Input voltage level
Voltage on enable pins
θ_JA
Thermal resistance (junction to ambient)
TDFN8
TDFN10
TDFN12
–55 to 150
260
150
–0.3 to 6
–0.3 to 6
–0.3 to 6
149.0
136.6
132.4
1. Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds.
Unit
°C
°C
°C
V
V
V
°C/W
°C/W
°C/W
Doc ID 13823 Rev 6
15/40