LPS25H Datasheet, PDF (13/45 Pages) STMicroelectronics – Embedded temperature compensation

LPS25H
4
Application hints
Application hints
Figure 5. LPS25H electrical connection
VDD
C1
C2
4.7 µF
GND
100 µF
GND
GND
VDD
10
9
8
VDD_IO ¹
SCL/SPC 2
7 _{INT 1}
TOP VIEW
6 CS
3
4
5
GND
The device core is supplied through the VDD line. Power supply decoupling capacitors
(100 nF, 4.7 µF) should be placed as near as possible to the supply pad of the device
(common design practice).
The functionality of the device and the measured data outputs are selectable and accessible
through the I²C/SPI interface. When using the I²C, CS must be tied high (i.e. connected to
VDD_IO).
4.1
Soldering information
The HCLGA package is compliant with the ECOPACK^® standard and it is qualified for
soldering heat resistance according to JEDEC J-STD-020.
DocID023722 Rev 5
13/45
45