HDN1102W-TR Datasheet, PDF (9/22 Pages) STANLEY ELECTRIC CO.,LTD. – 3.0 x 1.5 size, with Inner Lens Infrared emitting diode

Soldering condition
HDN1102W-TR
【Soldering Precaution】
(acc.to:EIAJ-4701/300)
1. Heat stress during soldering will influence the reliability of LEDs, however that effect will vary on
heating method. Also, if components of varying shape are soldered together, it is recommended to set
the soldering pad temperature according to the component most vulnerable to heat (e.g., surface
mount LED).
2. LED parts including the resin are not stable immediately after soldering ( when they are not at room
temperature), any mechanical stress may cause damage to the product. Please avoid such stress after
soldering, especially stacking of the boards which may cause the boards to warp and any other types
of friction with hard materials.
3. Recommended temperature profile for the Reflow soldering is listed as the temperature of the resin
surface. Temperature distribution varies on heating method, PCB material, other components in the
assembly, and mounting density.
Please do not repeat the heating process in Reflow process more than twice.
【Recommended Reflow Soldering Condition】
Peak Temperature
260℃ MAX.
(Soldering）
+1.5～+5℃/s
150℃～180℃
230℃ MAX.
90~120sec MAX.
（ Pre-heating）
40sec MAX.
-1.5～-5℃/s
Notes 1 Temperature Profile for the reflow should be set to the surface temperature of resin which is on the
top of LED. This should be the maximum temperature for soldering. Lowering the heating temperature
and decreasing heating time is very effective in achieving higher reliability.
Notes 2 The reflow soldering process should be done up to twice(2 times Max). When second process is performed,
interval between first and second process should be as short as possible to prevent absorption of moisture
to resin of LED. The second soldering process should not be done until LEDs have returned to room
temperature (by nature-cooling) after first soldering process.
2014.10.28
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