HDN1102W-TR Datasheet, PDF (12/22 Pages) STANLEY ELECTRIC CO.,LTD. – 3.0 x 1.5 size, with Inner Lens Infrared emitting diode

Packaging Specifications
HDN1102W-TR
This product is baked (moisture removal) before packaging, and is shipped in moisture-proof packaging (as
shown below) to minimize moisture absorption during transportation and storage. However, with regard to
storing the products, Stanley recommends the use of dry-box under the following conditions is recommended.
Moisture-proof bag as the packaging is made of anti-static material but packaging box is not.
【Recommended Storage Condition / Products Warranty Period 】
Temperature
+5～30℃
Humidity
Under 70%
In the case of the package unopened , 6 months under 【 Recommended Storage Condition 】.
Please avoid rapid transition from low temp. condition to high temp. condition
and storage in corroding and dusty environment.
【Time elapsed after Package Opening】
The package should not be opened until immediately prior to its use, and please keep the time frame
between package opening and soldering which is 【maximum 72h】.
If the device needs to be soldered twice, both soldering operations must be completed within 72h.
If any components should remain unused, please reseal the package and store them under the conditions
described in the 【 Recommended Storage Condition 】 above.
This product must be required to perform baking process (moisture removal)
for at 23h( MIN.) at 60±5 degrees Celsius if following conditions apply.
1.In the case of silica gel (blue) which indicates the moisture level within the package,
changes or loses its blue color.
2. In the case of time passes for 72h after the package is opened once.
Baking process should be performed after LED having been taken out of the package.
Baking may be performed in the tape-reel form , however if it is performed with the reel stacked over one
another, it may cause deformation of the reels and taping materials and later obstruct mounting. Please
handle only once it has returned to room temperature. Provided that, baking process shall be 2 times MAX.
2014.10.28
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