S75WS-N Datasheet, PDF (6/15 Pages) SPANSION – Stacked Multi-Chip Product (MCP)

Preliminary
2 Ordering Information
The ordering part number is formed by a valid combination of the following:
S75WS 256 N D F BA W L K 0
Packing Type
0
= Tray
2
= 7” Tape and Reel
3
= 13” Tape and Reel
RAM Supplier; Speed Combination
K
= RAM Type 4, 54 MHz
J
= RAM Type 4, 66 MHz
H
= RAM Type 4, 80 MHz
Package Dimensions and Ball Count; DYB Power Up;
Flash Device Family (Data Storage)
L
= 1.4 mm, 9 x 12, 84 ball; 0, WS as Data Flash
N
= 1.4 mm, 9 x 12, 84 ball; 1, WS as Data Flash
U
= 1.4mm, 11x13, 115-ball, x16 ORNAND Data Flash
S
= 1.4mm, 11x13, 115-ball, x8 ORNAND Data Flash
Temperature Range
W = Wireless (–25°C to +85°C)
Package Type And Material
BA = Very Thin Fine-Pitch Ball Grid Array (BGA),
Lead (Pb)-free Compliant Package
BF = Very Thin Fine-Pitch Ball Grid Array (BGA),
Lead (Pb)-free Package
Data Flash Density
F
= 512 Mb
G
= 1024 Mb
RAM Density
D
= 128 Mb
E
= 256 Mb
Process Technology
N
= 110 nm, Mirror Bit Technology
Code Flash Density
256 = 256 Mb
Device Family
S75WS = Multi-chip Product (MCP)
1.8-volt Burst Mode Flash Memory, RAM, and data flash
Table 2.1 MCP Configurations and Valid Combinations
S75WS256N
Valid Combination
D
F
BA, BF
W
L, N
Table 2.2 ORNAND Configurations and Valid Combinations
S75WS256N
Valid Combination
E
G
BA, BF
W
U, S
Package Marking Note:
The BGA package marking omits the leading S75 and packing type designator from the ordering part number.
K, H
K, J, H
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult
your local sales office to confirm availability of specific valid combinations and to check on newly
released combinations.
4
S75WS-N Based MCPs
S75WS-N_02_A2 October 6, 2005