S75WS-N Datasheet, PDF (13/15 Pages) SPANSION – Stacked Multi-Chip Product (MCP)

Preliminary
5.5 Physical Dimensions – FND115 – Fine Pitch Ball Grid Array 11 x 13 mm
D
0.15 C
(2X)
A
eD
D1
10
9
8
7
E
6
5
4
eE 3
2
1
SE 7
E1
PIN A1
CORNER
9
INDEX MARK
TOP VIEW
A A2
A1
6
SIDE VIEW
115X b
0.15 M C A B
0.08 M C
B
0.15 C
(2X)
0.20 C
P NM L K J H G F E D C B A
7
SD
BOTTOM VIEW
C
0.08 C
PIN A1
CORNER
PACKAGE
JEDEC
FND 115
N/A
DxE
SYMBOL
A
A1
A2
D
E
D1
E1
MD
ME
n
Øb
eE
eD
SD SE
13.00 mm x 11.00 mm
PACKAGE
MIN
NOM
MAX
NOTE
---
---
1.40 PROFILE
0.17
---
--- BALL HEIGHT
0.98
---
1.15 BODY THICKNESS
13.00 BSC.
BODY SIZE
11.00 BSC.
BODY SIZE
10.40 BSC.
MATRIX FOOTPRINT
7.20 BSC.
MATRIX FOOTPRINT
14
MATRIX SIZE D DIRECTION
10
MATRIX SIZE E DIRECTION
115
BALL COUNT
0.35
0.40
0.45 BALL DIAMETER
0.80 BSC.
BALL PITCH
0.80 BSC
BALL PITCH
0.40 BSC.
SOLDER BALL PLACEMENT
A3-A8,B3-B8,C1,N3-N8,P3-P8 DEPOPULATED SOLDER BALLS
NOTES:
1. DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JEP95, SECTION
4.3, SPP-010.
4. e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E"
DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL
POSITIONS FOR MATRIX SIZE MD X ME.
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7 SD AND SE ARE MEASURED WITH RESPECT TO
DATUMS A AND B AND DEFINE THE POSITION OF THE
CENTER SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS
IN THE OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS
IN THE OUTER ROW, SD OR SE = e/2
8. "+" INDICATES THE THEORETICAL CENTER OF
DEPOPULATED BALLS.
9. A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER
OR INK MARK, METALLIZED MARK INDENTATION OR
OTHER MEANS.
3524 \ 16-038.19 \ 10.5.05
October 6, 2005 S75WS-N_02_A2
S75WS-N Based MCPs
11