S75WS-N Datasheet, PDF (10/15 Pages) SPANSION – Stacked Multi-Chip Product (MCP)

Preliminary
5 Connection Diagrams/Physical Dimensions
This section contains the I/O designations and package specifications for the S75WS.
5.1 Special Handling Instructions for FBGA Package
Special handling is required for Flash Memory products in FBGA packages.
Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning meth-
ods. The package and/or data integrity may be compromised if the package body is exposed to
temperatures above 150°C for prolonged periods of time.
5.2 Connection Diagram – NOR Flash & 1.8 V RAM Type 4 Based Pinout, 9 x 12 mm
A1
A10
DNU
DNU
B2
B3
B4
B5
B6
B7
B8
B9
ADV# VSS
CLK
RFU F-VCC RFU
RFU
RFU
C2
C3
C4
C5
C6
C7
F1-WP# A7
R-LB# F-ACC WE#
A8
C8
C9
A11 F2-CE#
D2
D3
D4
D5
D6
D7
D8
D9
A3
A6
R-UB# F-RST# RFU
A19
A12
A15
E2
E3
E4
E5
E6
E7
E8
E9
A2
A5
A18
RDY
A20
A9
A13
A21
F2
F3
F4
F5
F6
F7
F8
F9
A1
A4
A17
RFU
A23
A10
A14
A22
G2
G3
G4
G5
G6
G7
G8
G9
A0
VSS
DQ1
RFU
RFU
DQ6
RFU
A16
H2
F1-CE#
H3
OE#
H4
DQ9
H5
DQ3
H6
DQ4
H7
DQ13
H8
DQ15
H9
R-MRS#
J2
R-CE1#
J3
DQ0
J4
DQ10
J5
F-VCC
J6
R-VCC
J7
DQ12
J8
DQ7
J9
VSS
K2
K3
K4
K5
K6
K7
K8
K9
RFU
DQ8
DQ2
DQ11
RFU
DQ5 DQ14 FD-WP#
L2
L3
L4
L5
L6
L7
L8
L9
RFU
RFU
VSS F-VCC F3-CE# RFU F-VCCQ DNU
M1
DNU
M10
DNU
Legend:
X
RFU
(Reserved for
Future Use)
X
Data Flash
Shared Only
X
Flash 2
Data Only
X
Flash 3
Data Only
X
Flash 1
Code Only
X
RAM Only
X
All Shared
X
All Flash
Shared Only
X
Do Not Use
8
S75WS-N Based MCPs
S75WS-N_02_A2 October 6, 2005