SKY66100_11 Datasheet, PDF (13/16 Pages) Skyworks Solutions Inc. – 169 to 170 MHz Transmit-Receive Front-End Module

Pin 1
Indicator
DATA SHEET • SKY66100-11: TRANSMIT/RECEIVE FEM
66100-11
STR#
Lot Code
Skyworks Part Number
Lot Code
Figure 15. Typical Part Marking
4.3
Stencil aperture size for center
ground pads should be 80% to
100% (by area) of the solder
mask opening of the package.
4X 0.075
0.5
0.4
0.05
0.15
0.05
4.3
4X 0.925
0.65 0.75
4X 0.075
4X 0.925
Stencil Aperture
Top View
Pin 16
Pin 1
Component Outline
(4.3)
(8X 0.8 Pitch)
(0.9)
Stencil and
Metallization
Solder Mask Opening
SMT Pad Detail
Scale: 2X
3X This Rotation
3X Rotated 180o
5X Rotated 90o CW
5X Rotated 90o CCW
Component Outline
Component Outline
4.4
2
Thermal Via Array.
∅0.3 mm on 0.6 mm pitch.
Additional vias in common
ground pad improve
thermal and electrical
performance.
(0.9)
(4.3)
0.25
Typ.
(4X 0.9 Pitch)
0
4X 0.8
4X 1.7
2X 1.825
2X 1.825
0
4X 0.8
Metallization
Top View
4.4 ₂
Component Outline
Solder Mask Opening
Top View
Notes:
1. The cross-hatched area represents the merger of the center ground pad +4 individual I/O ground pads. All I/O ground
pads should have at least one via connected to internal ground planes for optimum electrical performance.
2. Thermal vias should be tented with solder mask, 30 to 35 mm Cu plating recommended.
3. All measurements are in millimeters
Figure 16. PCB Layout Footprint for the SKY66100-11 4 x 4 mm MCM
S2895
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
201829E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • June 1, 2015
13