SKY85806-11 Datasheet, PDF (11/17 Pages) Skyworks Solutions Inc. – Dual-Band 802.11a-g-n-ac Wireless LAN

DATA SHEET • SKY85806-11: DUAL-BAND 802.11a/g/n/ac WIRELESS LAN FRONT END
Evaluation Board Description
The SKY85806-11 Evaluation Board is used to test the
performance of the SKY85806-11 WLAN PA. The Evaluation Board
schematic diagram is shown in Figure 5. A photograph of the
SKY85806-11 Evaluation Board is shown in Figure 6. Table 15
provides the Bill of Materials (BOM) for Evaluation Board
components.
Evaluation Board Test Procedure
1. Connect system ground to pin 3 on connectors J7 and J8.
2. Apply 3.3 V to pin1 on connector J7; apply 3.3 V to pins 1 and
2 on connector J8.
3. Apply 0 V and 3.3 V to appropriate control pin(s) as specified in
Table 13 for a given mode of operation.
4. Select an RF path to test according to the modes shown in
Table 13.
5. Connect a multimeter or oscilloscope to pin 11 of connector J7
(labeled VDET).
6. Apply an RF signal to connector J6 (ANT) to monitor the BT
port. Measure the response from the output of connector J1
(BT).
7. Apply an RF signal to connector J6 (ANT) to monitor the RXg to
ANT performance. Measure the response from the output of
connector J4 (RXg).
8. Apply an RF signal to connector J6 (ANT) to monitor the RXa to
ANT performance. Measure the response from the output of
connector J2 (RXa).
9. Apply an RF signal to connector J5 (TXg) to monitor the ANT to
TXg performance. Monitor the output power on connector J6
(ANT). Take care not to overdrive the amplifier by applying too
much RF on the input to the device (–20 dBm provides a
suitable starting input power).
10. Apply an RF signal to connector J3 (TXa) to monitor the ANT to
TXa performance. Monitor the output power on connector J6
(ANT). Take care not to overdrive the amplifier by applying too
much RF on the input to the device (–20 dBm provides a
suitable starting input power).
Package Dimensions
Typical case markings for the SKY85806-11 are shown in
Figure 7. The PCB layout footprint for the SKY85806-11 is
provided in Figure 8. Package dimensions for the 28-pin QFN are
shown in Figure 9, and tape and reel dimensions are provided in
Figure 10.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
The SKY85806-11 is rated to Moisture Sensitivity Level 3 (MSL3)
at 240 C, and can be used for lead or lead-free soldering. For
additional information, refer to the Skyworks Application Note,
Solder Reflow Information (Document Number 200164).
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
203186E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • February 6, 2015
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