SP6121CN-L Datasheet, PDF (41/42 Pages) Sipex Corporation – Low Voltage, Synchronous Step Down PWM Controller

Reliability Qualification Test Summary:
Stress Level Device Lot Number Burn-In Temp Sample Size No. Fail
168Hrs
SP6128A CF10190.1 125 °C
77
0
168Hrs
SP6128A CF10191.1 125 °C
77
0
168Hrs
SP6128A CF10192.1 125 °C
77
0
1000Hrs
SP6128A CF10190.1 125 °C
77
0
1000Hrs
SP6128A CF10191.1 125 °C
77
0
1000Hrs
SP6128A CF10192.1 125 °C
77
0
Life Test
Life testing is conducted to determine if there are any fundamental reliability related
failure mechanism(s) present in the device.
These failure mechanisms can be divided roughly into four groups:
1. Process or die related failures such as oxide defects, metallization defects, and
diffusion defects.
2. Assembly related failures such as chip mount defects, wire bond defects, molding
defects, and trim/form/singulation defects.
3. Design related defects.
4. Miscellaneous, undetermined, or application induced failures.
125C Operating Life Test Results
As part of the Sipex design qualification program, the Product/Reliability Engineering
group subjected 231 parts to 168 hours of 125° C life stress testing and then to 1000
hours of 125° C life stress testing.
168 Hour Timepoint
The 231 parts were subjected to the life test profile and completed the first phase with no
failures.
1000 Hour Timepoint
231 parts were reintroduced to life stress testing, completing the 1000 hour HTOL time
point without any failures or significant shifts in process parameters.
FIT Rate Calculations
FIT rate (failures in time) is the predicted number of failures per billion device hours.
This predicted value is based upon,
• The Life Test conditions summarized in the HTOL table (time/temperature, device
quantity, failure quantity).
• The Activation Energy (E_a) for potential failure modes. The weighted Activation
Energy(E_a) of observed failure mechanisms for Sipex products has been determined
to be 0.8eV.
SP6128A Reliability Report
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