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SI5350A-B Datasheet, PDF (6/29 Pages) Silicon Laboratories – FACTORY-PROGRAMMABLE ANY-FREQUENCY CMOS CLOCK GENERATOR
Si5350A-B
Table 6. Output Characteristics (Continued)
(VDD = 1.8 V ±5%, 2.5 V ±10%, or 3.3 V ±10%, TA = –40 to 85 °C)
Parameter
Symbol
Test Condition
Min
Typ Max Unit
Period Jitter2,3
JPER
20-QFN, 4 outputs running,
1 per VDDO
10-MSOP or 20-QFN,
all outputs running
—
40
95
ps pk-
pk
—
70 155
Cycle-to-Cycle Jitter2,3
JCC
20-QFN, 4 outputs running,
1 per VDDO
10-MSOP or 20-QFN,
all outputs running
—
50
90
ps pk
—
70 150
Notes:
1. Only two unique frequencies above 112.5 MHz can be simultaneously output.
2. Measured over 10k cycles. Jitter is only specified at the default high drive strength (50  output impedance).
3. Jitter is highly dependent on device frequency configuration. Specifications represent a “worst case, real world”
frequency plan; actual performance may be substantially better. Three-output 10MSOP package measured with clock
outputs of 74.25, 24.576, and 48 MHz. Eight-output 20QFN package measured with clock outputs of 33.33, 74.25, 27,
24.576, 22.5792, 28.322, 125, and 48 MHz.
Table 7. 25 MHz Crystal Requirements1,2
Parameter
Symbol
Min
Typ
Max
Unit
Crystal Frequency
fXTAL
—
25
—
MHz
Load Capacitance
CL
6
—
12
pF
Equivalent Series Resistance
rESR
—
—
150

Crystal Max Drive Level
dL
100
—
—
µW
Notes:
1. Crystals which require load capacitances of 6, 8, or 10 pF should use the device’s internal load capacitance for
optimum performance. See register 183 bits 7:6. A crystal with a 12 pF load capacitance requirement should use a
combination of the internal 10 pF load capacitance in addition to external 2 pF load capacitance (e.g., by using 4pF
capacitors on XA and XB).
2. Refer to “AN551: Crystal Selection Guide” for more details.
Table 8. 27 MHz Crystal Requirements1,2
Parameter
Symbol
Min
Typ
Max
Unit
Crystal Frequency
Load Capacitance
Equivalent Series Resistance
Crystal Max Drive Level Spec
fXTAL
CL
rESR
dL
—
27
—
MHz
6
—
12
pF
—
—
150

100
—
—
µW
Notes:
1. Crystals which require load capacitances of 6, 8, or 10 pF should use the device’s internal load capacitance for
optimum performance. See register 183 bits 7:6. A crystal with a 12 pF load capacitance requirement should use a
combination of the internal 10 pF load capacitance in addition to external 2 pF load capacitance (e.g., by using 4pF
capacitors on XA and XB).
2. Refer to “AN551: Crystal Selection Guide” for more details.
6
Rev. 1.0