SI861X Datasheet, PDF (35/38 Pages) Silicon Laboratories – Low-Power Single and Dual-Channel Digital Isolators

13. Document Change List
Revision 0.1 to Revision 0.2
• Added chip graphics on page 1.
• Moved Tables 1 and 11 to page 21.
• Updated Table 6, “Insulation and Safety-Related Specifications,” on page 18.
• Updated Table 8, “IEC 60747-5-5 Insulation Characteristics for Si86xxxx*,” on page 19.
• Moved Table 1 to page 4.
• Moved “Typical Performance Characteristics” to page 7.
• Updated "3. Pin Descriptions (Wide-Body SOIC)" on page 9.
• Updated "4. Pin Descriptions (Narrow-Body SOIC)" on page 10.
• Updated "5. Ordering Guide" on page 11.
Revision 0.2 to Revision 0.3
• Added chip graphics on page 1.
• Updated Table 6, “Insulation and Safety-Related Specifications,” on page 18.
• Updated Table 8, “IEC 60747-5-5 Insulation Characteristics for Si86xxxx*,” on page 19.
• Updated "3. Pin Descriptions (Wide-Body SOIC)" on page 9.
• Updated "4. Pin Descriptions (Narrow-Body SOIC)" on page 10.
• Updated "5. Ordering Guide" on page 11.
Revision 0.3 to Revision 1.0
• Updated “Table 3. Electrical Characteristics”.
• Reordered spec tables to conform to new convention.
• Removed “pending” throughout document.
Revision 1.0 to Revision 1.1
• Updated High Level Output Voltage VOH to 3.1 V in Table 3, “Electrical Characteristics,” on page 9.
• Updated High Level Output Voltage VOH to 2.3 V in Table 4, “Electrical Characteristics,” on page 13.
Revision 1.1 to Revision 1.2
• Updated Table 1 on page 4.
• Deleted reference to EN.
• Updated "5. Ordering Guide" on page 11 to include MSL2A.
Revision 1.2 to Revision 1.3
• Updated Table 11 on page 21.
• Added junction temperature spec.
• Updated "2.3.1. Supply Bypass" on page 6.
• Removed “3.3.2. Pin Connections” on page 22.
• Updated "5. Ordering Guide" on page 11.
• Removed Rev A devices.
• Updated "6. Package Outline: 16-Pin Wide Body SOIC" on page 13.
• Updated Top Marks.
• Added revision description.
Revision 1.3 to Revision 1.4
• Added Figure 2, “Common Mode Transient Immunity Test Circuit,” on page 8.
• Added references to CQC throughout.
• Added references to 2.5 kV_RMS devices throughout.
• Updated "5. Ordering Guide" on page 11.
• Updated "10.1. 16-Pin Wide Body SOIC Top Marking" on page 18.
Si861x/2x Data Sheet
Document Change List
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