SI7013-A20 Datasheet, PDF (18/45 Pages) Silicon Laboratories – IC HUMIDITY AND TWO-ZONE TEMPERATURE SENSOR

Si7013-A20
4.4.3. Rework
To maintain the specified sensor performance, care must be taken during rework to minimize the exposure of the
device to excessive heat and to avoid damage/contamination or a shift in the sensor reading due to liquids, solder
flux, etc. Manual touch-up using a soldering iron is permissible under the following guidelines:
The exposed polymer sensing film must be kept clean and undamaged. A protective cover is
recommended during any rework operation (Kapton® tape or the factory installed cover).
Flux must not be allowed to contaminate the sensor; liquid flux is not recommended even with a cover in
place. Conventional lead-free solder with rosin core is acceptable for touch-up as long as a cover is in
place during the rework.
If possible, avoid water or solvent rinses after touch-up. Cleaning after soldering is possible, but must be
done carefully to avoid impacting the performance of the sensor. See “AN607: Si70xx Humidity Sensor
Designer’s Guide” for more information on cleaning.
Minimize the heating of the device. Soldering iron temperatures should not exceed 350 °C and the contact
time per pin should not exceed five seconds.
Hot air rework is not recommended. If a device must be replaced, remove the device by hot air and solder
a new part in its place by reflow following the guidelines above.
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Figure 10. Si70xx with Factory-Installed Protective Cover
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Rev. 1.1