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LRS1383 Datasheet, PDF (28/114 Pages) Sharp Electrionic Components – STACKED CHIP 32M FLASH AND 8M SRAM
LRS1383
26
12.6 Reset Operations(1,2)
Symbol
Parameter
(TA = -25°C to +85°C, F-VCC = 2.7V to 3.3V)
Notes
Min.
Max.
Unit
tPLPH
F-RST Low to Reset during Read
(F-RST should be low during power-up.)
1, 2, 3
100
ns
tPLRH F-RST Low to Reset during Erase or Program
1, 3, 4
22
s
tVPH F-VCC 2.7V to F-RST High
1, 3, 5
100
ns
tVHQV F-VCC 2.7V to Output Delay
3
1
ms
Notes:
1. A reset time, tPHQV, is required from the later of SR.7 (F-RY/BY) going "1" (High-Z) or F-RST going high until outputs
are valid. See the AC Characteristics - read cycle for tPHQV.
2. tPLPH is <100ns the device may still reset but this is not guaranteed.
3. Sampled, not 100% tested.
4. If F-RST asserted while a block erase, full chip erase, (page buffer) program or OTP program operation is not executing,
the reset will complete within 100ns.
5. When the device power-up, holding F-RST low minimum 100ns is required after F-VCC has been in predefined range and
also has been in stable there.
AC Waveform for Reset Operation