GX3202 Datasheet, PDF (48/49 Pages) Semtech Corporation – Crosspoint Switch with Trace Equalization and Output De-emphasis

6.4 Solder Reflow Profile
The GX3202 is available in a Pb-free package. It is recommended that the Pb-free
package be soldered with Pb-free paste using the reflow profile shown in Figure 6-1.
Device Surface Temperature (°C)
250
1.0 - 2.0°C/s
200
180°C
Pre Heating Zone
150
150°C
60 - 120s
100
50
1.0 - 2.0°C/s
Peak 245°C
230°C
Soldering
Zone
10 - 15s
1.5 - 2.0°C/s
Heating Time
Figure 6-1: Maximum Pb-free Solder Reflow Profile
6.5 Ordering Information
Part Number
GX3202-CBE3
Package
50x50mm HFC-BGA
Appendix - Relevant Documentation
Temperature Range
0°C to 85°C
Document Description
EB-GX3290 Schematics, PCB Layout and Bill of Materials
GX3290 Host Control Software User Manual
Using the Monitoring Features of the GX3290 Application
Note
GX3290 (and family) Crosspoint Ball Guide
Crosspoint Design Guide
Crosspoint (GX3290 and family) Reference Manual (for CSRs)
Document Identification
56057
55970
58329
56697
56004
56832
GX3202 202 x 202 3.5Gb/s Crosspoint
Data Sheet
56077 - 1
October 2012
48 of 49
Proprietary & Confidential