SKYPER32PROR_0701 Datasheet, PDF (3/18 Pages) Semikron International – IGBT Driver Core

SKYPER™ 32PRO R
Please note:
Unless otherwise specified, all values in this technical explanation are typical values. Typical values are the average values expected in
large quantities and are provided for information purposes only. These values can and do vary in different applications. All operating
parameters should be validated by user’s technical experts for each application.
Application and Handling Instructions
ƒ Please provide for static discharge protection during handling. As long as the hybrid driver is not completely assembled,
the input terminals have to be short-circuited. Persons working with devices have to wear a grounded bracelet. Any
synthetic floor coverings must not be statically chargeable. Even during transportation the input terminals have to be
short-circuited using, for example, conductive rubber. Worktables have to be grounded. The same safety requirements
apply to MOSFET- and IGBT-modules.
ƒ Any parasitic inductances within the DC-link have to be minimised. Over-voltages may be absorbed by C- or RCD-
snubbers between main terminals for PLUS and MINUS of the power module.
ƒ When first operating a newly developed circuit, SEMIKRON recommends to apply low collector voltage and load current
in the beginning and to increase these values gradually, observing the turn-off behaviour of the free-wheeling diode and
the turn-off voltage spikes generated across the IGBT. An oscillographic control will be necessary. Additionally, the case
temperature of the module has to be monitored. When the circuit works correctly under rated operation conditions,
short-circuit testing may be done, starting again with low collector voltage.
ƒ It is important to feed any errors back to the control circuit and to switch off the device immediately in failure events.
Repeated turn-on of the IGBT into a short circuit with a high frequency may destroy the device.
ƒ The inputs of the hybrid driver are sensitive to over-voltage. Voltages higher than VS +0,3V or below -0,3V may destroy
these inputs. Therefore, control signal over-voltages exceeding the above values have to be avoided.
ƒ The connecting leads between hybrid driver and the power module should be as short as possible (max. 20cm), the
driver leads should be twisted.
Further application support
Latest information is available at http://www.semikron.com. For design support please read the SEMIKRON Application
Manual Power Modules available at http://www.semikron.com.
General Description
The SKYPER™ 32PRO core constitutes an interface between IGBT modules and the controller. This core is a half bridge
driver. Functions for driving, potential separation and protection are integrated in the driver. Thus it can be used to build up a
driver solution for IGBT modules.
Features of SKYPER™ 32PRO
ƒ Two output channels
ƒ Integrated potential free power supply for secondary side
ƒ Short Pulse Suppression (SPS)
ƒ Under Voltage Protection (UVP) primary & secondary
ƒ Under Voltage Reset (UVR)
ƒ Drive interlock (dead time) top / bottom (DT) adjustable
ƒ Dynamic Short Circuit Protection (DSCP) by VCE monitoring and direct
switch off
ƒ Soft Turn-Off (STO)
ƒ Halt Logic Signal (HLS)
ƒ Failure Management
ƒ External Error Input
ƒ DC bus voltage up to 1200V
ƒ Coated with varnish
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2007-01-19 – Rev03
SKYPER™ 32PRO
© by SEMIKRON