SKYPER32PROR_0701 Datasheet, PDF (16/18 Pages) Semikron International – IGBT Driver Core

SKYPER™ 32PRO R
Application Example
Connection Schematic
SKYPER^TM 32PRO
STATUS OUTPUT
STATUS INPUT
INPUT TOP
INPUT BOT
+15V
>_ 1
x1 y
x2
1nF
100V
1nF
100V
1nF
100V
1nF
100V
1nF
100V
220µF
35V
PRIM_nPWRFAIL_IN
PRIM_HALT_OUT
PRIM_HALT_IN
PRIM_PWR_GND
PRIM_PWR_GND
PRIM_TOP_IN
PRIM_BOT_IN
PRIM_PWR_15P
PRIM_PWR_15P
PRIM_PWR_GND
PRIM_PWR_GND
PRIM_CFG_TDT2_IN
PRIM_CFG_SELECT_IN
PRIM_CFG_TDT_3_IN
PRIM_CFG_TDT1_IN
PRIM_PWR_GND
PRIM_PWR_GND
SEC_TOP_VCE_CFG
SEC_TOP_VCE_IN
SEC_TOP_15P
SEC_TOP_ERR_IN
SEC_TOP_IGBT_ON
SEC_TOP_IGBT_OFF
SEC_TOP_GND
SEC_TOP_GND
SEC_TOP_IGBT_SOFTOFF
SEC_TOP_8N
SEC_BOT_VCE_CFG
SEC_BOT_VCE_IN
SEC_BOT_15P
SEC_BOT_ERR_IN
SEC_BOT_IGBT_ON
SEC_BOT_IGBT_OFF
SEC_BOT_GND
SEC_BOT_GND
SEC_BOT_IGBT_SOFTOFF
SEC_BOT_8N
EXTERNAL ERROR SIGNAL
DC+
BY 20 3/20 S
330pF
18k
50V
Ron
Roff
10k
Roff_sc
load
BY 20 3/20 S
330pF
18k
50V
Ron
Roff
10k
Roff_sc
DC-
- application example for 1200V IGBT
- dead time: 3µs
- UVR disable
- VCEref = 5,5V
- tbl = 5,1µs
- EEI TOP enable (using external transistor in switch mode)
- EEI BOT disable
- STO
Mounting Notes
Soldering Hints
Drill Hole & Pad Size in mm
The temperature of the solder must not exceed 260°C, and solder time must
not exceed 10 seconds.
The ambient temperature must not exceed the specified maximum storage
temperature of the driver.
The solder joints should be in accordance to IPC A 610 Revision D (or later) -
Class 3 (Acceptability of Electronic Assemblies) to ensure an optimal
connection between driver core and printed circuit board.
Please note:
The driver is not suited for hot air reflow or infrared reflow processes.
16
2007-01-19 – Rev03
© by SEMIKRON