K4T1G044QM Datasheet, PDF (4/29 Pages) Samsung semiconductor – 1Gb M-die DDR2 SDRAM Specification

1Gb M-die DDR2 SDRAM
DDR2 SDRAM
2. Package Pinout/Mechnical Dimension & Addressing
2.1 Package Pinout
x4 package pinout (Top View) : 68ball FBGA Package(60balls + 8balls of dummy balls)
1
2
3
NC
NC
A
B
C
D
VDD
NC
VSS
E
NC
VSSQ
DM
F
VDDQ DQ1 VDDQ G
NC
VSSQ DQ3
H
VDDL VREF
VSS
J
CKE
WE
K
BA2
BA0
BA1
L
A10/AP
A1
M
VSS
A3
A5
N
A7
A9
P
VDD
A12
NC
R
T
U
V
NC
NC
W
7
8
9
NC
NC
VSSQ DQS VDDQ
DQS VSSQ
NC
VDDQ DQ0 VDDQ
DQ2 VSSQ
NC
VSSDL CK
VDD
RAS
CK
ODT
CAS
CS
A2
A0
VDD
A6
A4
A11
A8
VSS
NC
A13
NC
NC
Notes:
1. Pin E3 has identical
capacitance as pin E7.
2. VDDL and VSSDL are
power and ground for the
DLL.
Ball Locations (x4)
: Populated Ball
+ : Depopulated Ball
Top View (See the balls through the Package)
123456789
A
+ + +++
B + ++ + +++ ++
C + ++ + +++ ++
D + ++ + +++ ++
E
+ ++
F
+ ++
G
+ ++
H
+ ++
J
+ ++
K+
+ ++
L
+ ++
+
M+
+ ++
N
+ ++
+
P+
+ ++
R
+ ++
+
T + ++ + +++ ++
U + ++ + +++ ++
V + ++ + +++ ++
W
+ + +++
Page 4 of 29
Rev.1.1 Jan. 2005