K4H641638N Datasheet, PDF (3/10 Pages) Samsung semiconductor – DDR SDRAM Product Guide

General Information
DDR SDRAM
B. DDR SDRAM Component Product Guide
Density
64Mb N-die
256Mb H-die
256Mb J-die
512Mb D-die
Bank Part Number
Package^*1 & Power^*2 &
Speed^*3
4Banks K4H641638N
LCCC/CB3
LLCC/LB3
FCCC/CB3
FLCC/LB3
K4H560438H
UCA2/CB0
ULA2/LB0
ZCCC/CB3
ZLCC/LB3
4Banks K4H560838H
UCCC/CB3
ULCC/LB3
ZCCC/CB3
ZLCC/LB3
K4H561638H
UCCC/CB3
ULCC/LB3
ZCCC/CB3
ZLCC/LB3
K4H560438J
LCB3/CB0
LLB3/LB0
4Banks K4H560838J
LCCC/CB3
LLCC/LB3
K4H561638J
LCCC/CB3
LLCC/LB3
K4H510438D
UCB0
ULB0
ZCCC
ZLCC
4Banks K4H510838D
UCCC/CB3
ULCC/LB3
ZCCC/CB3
ZLCC/LB3
K4H511638D
UCCC/CB3
ULCC/LB3
ZCCC/CB3
ZLCC/LB3
Org. Interface Refresh Power (V)
Package
4M x 16 SSTL_2 4K/64m 2.5 ± 0.2V
66pinTSOPII
60ball FBGA
64M x 4
66pinTSOPII
60ball FBGA
32M x 8 SSTL_2 8K/64m 2.5 ± 0.2V^*4
60ball FBGA
60ball FBGA
16M x 16
66pinTSOPII
60ball FBGA
64M x 4
66pinTSOPII
32M x 8 SSTL_2 8K/64m 2.5 ± 0.2V^*4
66pinTSOPII
16M x 16
66pinTSOPII
128M x 4
66pinTSOPII
60ball FBGA
64M x 8 SSTL_2 8K/64m 2.5 ± 0.2V^*4
66pinTSOPII
60ball FBGA
32M x 16
66pinTSOPII
60ball FBGA
Avail.
Now
CS
Now
CS
CS
CS
Now
Note 1 :
U : TSOP II (Lead-free)
V : sTSOP II (Lead-free)
Z : FBGA (Lead-free)
L : TSOP II (Lead-free & Halogen-free)
H : FBGA (Lead-free & Halogen-free)
F : FBGA for 64Mb DDR (Lead-free & Halogen-free)
6 : sTSOP II (Lead-free & Halogen-free)
Note 2 :
C Commercial Temperature, Normal Power
L Commercial Temperature, Low Power
- Commercial Temp. (0°C <Ta< 70°C)
Note 3 :
133Mhz
166Mhz
200Mhz
CL = 2 DDR266(A2)
-
-
CL = 2.5 DDR266(B0) DDR333(B3)
-
CL = 3
-
-
DDR400(CC)
- "B3" has compatibility with "A2" and "B0"
Note 4 :
DDR400 DDR333/266
VDD/VDDQ 2.6V ± 0.1V 2.5V ± 0.2V
December 2007