K4S640432H-UC Datasheet, PDF (11/14 Pages) Samsung semiconductor – 64Mb H-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant)

SDRAM 64Mb H-die (x4, x8, x16)
AC CHARACTERISTICS (AC operating conditions unless otherwise noted)
Parameter
CLK cycle time
CAS latency=3
CAS latency=2
CLK to valid
output delay
CAS latency=3
CAS latency=2
Output data
hold time
CAS latency=3
CAS latency=2
CLK high pulse width
CLK low pulse width
Input setup time
Input hold time
CLK to output in Low-Z
CLK to output
in Hi-Z
CAS latency=3
CAS latency=2
Symbol
tCC
tSAC
tOH
tCH
tCL
tSS
tSH
tSLZ
tSHZ
60
Min
Max
6
1000
-
5
-
2.5
-
2.5
2.5
1.5
1
1
5
-
70
Min
Max
7
1000
-
6
-
3
-
3
3
2
1
1
6
-
Notes : 1. Parameters depend on programmed CAS latency.
2. If clock rising time is longer than 1ns, (tr/2-0.5)ns should be added to the parameter.
3. Assumed input rise and fall time (tr & tf) = 1ns.
If tr & tf is longer than 1ns, transient time compensation should be considered,
i.e., [(tr + tf)/2-1]ns should be added to the parameter.
CMOS SDRAM
75
Min
Max
7.5
1000
10
5.4
6
3
3
2.5
2.5
1.5
0.8
1
5.4
6
Unit Note
ns
1
ns 1,2
ns
2
ns
3
ns
3
ns
3
ns
3
ns
2
ns
DQ BUFFER OUTPUT DRIVE CHARACTERISTICS
Parameter
Symbol
Condition
Min
Typ
Max
Output rise time
trh
Measure in linear
region : 1.2V ~ 1.8V
1.37
4.37
Output fall time
tfh
Measure in linear
region : 1.2V ~ 1.8V
1.30
3.8
Output rise time
trh
Measure in linear
region : 1.2V ~ 1.8V
2.8
3.9
5.6
Output fall time
tfh
Measure in linear
region : 1.2V ~ 1.8V
2.0
2.9
5.0
Notes : _{1. Rise time specification based on 0pF + 50 Ω to VSS, use these values to design to.}
2. Fall time specification based on 0pF + 50 Ω to VDD, use these values to design to.
3. Measured into 50pF only, use these values to characterize to.
4. All measurements done with respect to VSS.
Unit
Volts/ns
Volts/ns
Volts/ns
Volts/ns
Notes
3
3
1,2
1,2
Rev. 1.3 August 2004