SP2013 Datasheet, PDF (6/8 Pages) SamHop Microelectronics Corp. – Super high dense cell design for low RDS(ON).

SP2013
PACKAGE OUTLINE DIMENSIONS
TSON 3.3 x 3.3
A
C
M
D D1
PIN 1
e
D3
L1
D2
0
Ver 1.1
E2
H
L
b
E1
E
SYMBOLS
A
b
C
D
D1
D2
D3
E
E1
E2
e
H
L
L1
M
0
MILLIMETERS
MIN.
0.70
NOM.
0.75
0.25
0.30
0.10
0.15
3.25
3.35
3.00
3.10
1.78
1.88
0.13
3.20
3.30
3.00
3.15
2.39
2.49
0.65 BSC
0.30
0.39
0.30
0.40
0.13
10^o
MAX.
0.80
0.35
0.25
3.45
3.20
1.98
3.40
3.20
2.59
0.50
0.50
0.15
12^o
6
Jul,18,2013
www.samhop.com.tw