PD178016GC-051_15 Datasheet, PDF (91/96 Pages) Renesas Technology Corp – 8-BIT SINGLE-CHIP MICROCONTROLLER WITH BUILT-IN PRESCALER, PLL FREQUENCY SYNTHESIZER, AND IF COUNTER FOR AUTOMOTIVE FM/MW/LW RADIO APPLICATIONS

µPD178016GC-051
14. RECOMMENDED SOLDERING CONDITIONS
The conditions listed below shall be met when soldering the µPD178016GC-051.
For details of the recommended soldering conditions, refer to our document SMD Surface Mount Technology
Manual (C10535E).
Please consult with our sales offices in case any other soldering process is used, or in case soldering is done under
different conditions.
Table 14-1. Soldering Conditions for Surface-Mount Devices
µPD178016GC-051-3B9: 80-pin plastic QFP (14 × 14 mm, 0.65-mm pitch)
Soldering process
Infrared ray reflow
VPS
Wave soldering
Partial heating method
Soldering conditions
Peak package’s surface temperature: 235 °C
Reflow time: 30 seconds or less (at 210 °C or more)
Maximum allowable number of reflow processes: 3
Peak package’s surface temperature: 215 °C
Reflow time: 40 seconds or less (at 200 °C or more)
Maximum allowable number of reflow processes: 3
Solder temperature: 260 °C or less
Flow time: 10 seconds or less
Number of flow processes: 1
Preheating temperature: 120 °C max. (measured on the
package surface)
Terminal temperature: 300 °C or less
Heat time: 3 seconds or less (for one side of a device)
Symbol
IR35-00-3
VP15-00-3
WS60-00-1
—
Caution Do not apply more than a single process at once, except for “Partial heating method.”
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