PD17225_15 Datasheet, PDF (77/86 Pages) Renesas Technology Corp – 4-BIT SINGLE-CHIP MICROCONTROLLER FOR SMALL GENERAL-PURPOSE INFRARED REMOTE CONTROL TRANSMITTER

µPD17225, 17226, 17227, 17228
16. RECOMMENDED SOLDERING CONDITIONS
For the µPD17225 soldering must be performed under the following conditions.
For details of recommended conditions for surface mounting, refer to information document "Semiconductor
Device Mounting Technology Manual" (C10535E).
For other soldering methods, please consult with NEC personnel.
Table 16-1. Soldering Conditions of Surface Mount Type
(1) µPD17225GT-×××: 28-pin plastic SOP (375 mil)
µPD17226GT-×××: 28-pin plastic SOP (375 mil)
µPD17227GT-×××: 28-pin plastic SOP (375 mil)
µPD17228GT-×××: 28-pin plastic SOP (375 mil)
Soldering Method
Infrated Reflow
VPS
Wave Soldering
Partial Heating
Soldering Conditions
Package peak temperature: 235 °C, Time: 30 seconds max. (210 °C min.),
Number of times: 2 max.
Package peak temperature: 215 °C, Time: 40 seconds max. (200 °C min.),
Number of times: 2 max.
Solder bath temperature: 260 °C max, Time: 10 seconds max., Number of times:
once, preheating temperature: 120 °C max. (package surface temperature)
Pin temperature: 300 °C max., Time: 3 seconds max. (per side of device)
Symbol
IR35-00-2
VP15-00-2
WS66-00-1
—
Caution Do not use two or more soldering methods in combination (except the partial heating method).
(2) µPD17225MC-×××-5A4: 30-pin plastic shrink SOP (300 mil)
µPD17226MC-×××-5A4: 30-pin plastic shrink SOP (300 mil)
µPD17227MC-×××-5A4: 30-pin plastic shrink SOP (300 mil)
µPD17228MC-×××-5A4: 30-pin plastic shrink SOP (300 mil)
Soldering Method
Infrated Reflow
VPS
Wave Soldering
Partial Heating
Soldering Conditions
Package peak temperature: 235 °C, Time: 30 seconds max. (210 °C min.),
Number of times: 3 max.
Package peak temperature: 215 °C, Time: 40 seconds max. (200 °C min.),
Number of times: 3 max.
Solder bath temperature: 260 °C max, Time: 10 seconds max., Number of times:
once, preheating temperature: 120 °C max. (package surface temperature)
Pin temperature: 300 °C max., Time: 3 seconds max. (per side of device)
Symbol
IR35-00-3
VP15-00-3
WS66-00-1
—
Caution Do not use two or more soldering methods in combination (except the partial heating method).
Table 16-2. Soldering Conditions of Through-Hole Type
µPD17225CT-×××: 28-pin plastic shrink DIP (400 mil)
µPD17226CT-×××: 28-pin plastic shrink DIP (400 mil)
µPD17227CT-×××: 28-pin plastic shrink DIP (400 mil)
µPD17228CT-×××: 28-pin plastic shrink DIP (400 mil)
Soldering Method
Wave Soldering
(Only for pins)
Partial Heating
Soldering Conditions
Solder bath temperature: 260 °C max., Time: 10 seconds max.
Pin temperature: 300 °C max., Time: 3 seconds max. (per pin)
Caution The wave solding must be performed at the lead part only. Note that the solder must not be directly
contacted to the package body.
Data Sheet U12643EJ2V0DS00
75