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R1EV58064BXXN_15 Datasheet, PDF (6/25 Pages) Renesas Technology Corp – 64K EEPROM (8-Kword × 8-bit) Ready/Busy function
R1EV58064BxxN Series/R1EV58064BxxR Series
AC Characteristics
Ta = −40 to +85°C, VCC = 2.7 to 5.5 V
Test Conditions
• Input pulse levels : 0.4 V to 2.4 V (VCC = 2.7 to 3.6 V), 0.4 V to 3.0 V (VCC = 3.6 to 5.5 V)
0 V to VCC (RES pin*2)
• Input rise and fall time : ≤ 5 ns
• Input timing reference levels : 0.8, 1.8 V
• Output load : 1TTL Gate +100 pF
• Output reference levels : 1.5 V, 1.5 V
Read Cycle 1 (2.7 ≤ VCC < 4.5 V)
Parameter
Symbol
Min
Address to output delay
tACC
⎯
CE to output delay
tCE
⎯
OE to output delay
tOE
10
Address to output hold
tOH
0
OE (CE) high to output float*1
tDF
0
RES low to output float*1, 2
tDFR
0
RES to output delay*2
tRR
0
Max
100
100
50
⎯
40
350
450
Unit
ns
ns
ns
ns
ns
ns
ns
Test conditions
CE = OE = VIL, WE = VIH
OE = VIL, WE = VIH
CE = VIL, WE = VIH
CE = OE = VIL, WE = VIH
CE = VIL, WE = VIH
CE = OE = VIL, WE = VIH
CE = OE= VIL, WE = VIH
Write Cycle 1 (2.7 ≤ VCC < 4.5 V)
Parameter
Symbol Min*3 Typ Max Unit Test conditions
Address setup time
tAS
0
⎯
⎯ ns
Address hold time
tAH
50
⎯
⎯ ns
CE to write setup time (WE controlled)
tCS
0
⎯
⎯ ns
CE hold time (WE controlled)
tCH
0
⎯
⎯ ns
WE to write setup time (CE controlled)
tWS
0
⎯
⎯ ns
WE hold time (CE controlled)
tWH
0
⎯
⎯ ns
OE to write setup time
tOES
0
⎯
⎯ ns
OE hold time
tOEH
0
⎯
⎯ ns
Data setup time
tDS
50
⎯
⎯ ns
Data hold time
tDH
0
⎯
⎯ ns
WE pulse width (WE controlled)
tWP
200
⎯
⎯ ns
CE pulse width (CE controlled)
tCW
200
⎯
⎯ ns
Data latch time
tDL
100
⎯
⎯ ns
Byte load cycle
tBLC
0.3
⎯
30 μs
Byte load window
Write cycle time
tBL
100
⎯
⎯ μs
tWC
⎯
⎯
10*4 ms
Time to device busy
Write start time
Reset protect time*2
Reset high time*2, 6
tDB
120
⎯
⎯ ns
tDW
0*5
⎯
⎯ ns
tRP
100
⎯
⎯ μs
tRES
1
⎯
⎯ μs
Notes: 1. tDF and tDFR are defined as the time at which the outputs achieve the open circuit conditions and
are no longer driven.
2. This function is supported by only the R1EV58064BxxR series.
3. Use this device in longer cycle than this value.
4. tWC must be longer than this value unless polling techniques or RDY/Busy are used. This device automatically
completes the internal write operation within this value.
5. Next read or write operation can be initiated after tDW if polling techniques or RDY/Busy are used.
6. This parameter is sampled and not 100% tested.
7. A6 through A12 are page addresses and these addresses are latched at the first falling edge of WE.
8. A6 through A12 are page addresses and these addresses are latched at the first falling edge of CE.
9. See AC read characteristics.
R10DS0207EJ0100 Rev.1.00
Jun 09, 2014
Page 6 of 23