HYS64T32X00EDL Datasheet, PDF (5/86 Pages) Qimonda AG – 200-Pin SO-DIMM DDR2 SDRAM Modules

Internet Data Sheet
HYS64T[32/64/128]xxxEDL–[25F/…/3.7](–)B2
Small Outlined DDR2 SDRAM Modules
Product Type¹⁾
Compliance Code²⁾
Description
SDRAM
Technology
PC2–4200
HYS64T32000EDL–3.7–B2
HYS64T32900EDL–3.7–B2
256 MB 1R × 16 PC2–4200S–444–12–C0
1 Rank, Non-ECC
512 Mbit (×16)
HYS64T64020EDL–3.7–B2
HYS64T64920EDL–3.7–B2
512 MB 2R × 16 PC2–4200S–444–12–A0
2 Rank, Non-ECC
512 Mbit (×16)
HYS64T128021EDL–3.7B2
HYS64T128921EDL–3.7B2
1 GB 2R × 8 PC2-4200S–444–12–E0
2 Rank, Non-ECC
512 Mbit (×8)
1) All Product Type numbers end with a place code, designating the silicon die revision. Example: HYS64T64020EDL–3.7–B2, indicating
Rev. “B” dies are used for DDR2 SDRAM components. For all Qimonda DDR2 module and component nomenclature see Chapter 6 of
this data sheet.
2) The Compliance Code is printed on the module label and describes the speed grade, for example “PC2–4200S–444–12–A0”, where
4200S means Small Outlined Unbuffered DIMM modules with 4.26 GB/sec Module Bandwidth and “444-12” means Column Address
Strobe (CAS) latency = 4, Row Column Delay (RCD) latency = 4 and Row Precharge (RP) latency = 4 using the latest JEDEC SPD
Revision 1.2 and produced on the Raw Card “A”.
DIMM
Density
256 MByte
512 MByte
1 GByte
Module
Organization
32M × 64
64M × 64
128M × 64
Memory
Ranks
1
2
2
ECC/
Non-ECC
Non-ECC
Non-ECC
Non-ECC
TABLE 3
Address Format
# of SDRAMs # of row/bank/column
bits
Raw
Card
4
13/2/10
C
8
13/2/10
A
16
14/2/10
E
Product Type¹⁾²⁾
DRAM Components²⁾
DRAM Density
TABLE 4
Components on Modules
DRAM Organisation
HYS64T32000EDL
HYS64T32900EDL
HYB18T512160B2F
512 Mbit
32M × 16
HYS64T64020EDL
HYS64T64920EDL
HYB18T512160B2F
512 Mbit
32M × 16
HYS64T128021EDL
HYS64T128921EDL
HYB18T512800B2F
512 Mbit
64M × 8
1) For a detailed description of all functionalities of the DRAM components on these modules see the component data sheet.
2) Green Product
Rev. 1.1, 2007-01
5
08212006-PKYN-2H1B