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HYS64T32X00EDL Datasheet, PDF (3/86 Pages) Qimonda AG – 200-Pin SO-DIMM DDR2 SDRAM Modules | |||
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Internet Data Sheet
1
Overview
HYS64T[32/64/128]xxxEDLâ[25F/â¦/3.7](â)B2
Small Outlined DDR2 SDRAM Modules
This chapter gives an overview of the 200-Pin SO-DIMM DDR2 SDRAM Modules product family and describes its main
characteristics.
1.1
Features
⢠200-Pin PC2â6400, PC2â5300 and PC2â4200 DDR2
SDRAM memory modules for use as main memory when
installed in systems such as mobile personal computers.
⢠32M à 64, 64M à 64 and 128M à 64 module
organization,and 32M Ã 16, 64M Ã 8 chip organization
⢠Standard Double-Data-Rate-Two Synchronous DRAMs
(DDR2 SDRAM) with a single + 1.8 V (± 0.1 V) power
supply
⢠256MB, 512MB and 1GB modules built with 512-Mbit
DDR2 SDRAMs in PG-TFBGA-60 and PG-TFBGA-84
chipsize packages
⢠Programmable CAS Latencies (3, 4 ,5 and 6), Burst
Length (8 & 4) and Burst Type
⢠Auto Refresh (CBR) and Self Refresh
⢠Programmable self refresh rate via EMRS2 setting
⢠Programmable partial array refresh via EMRS2 settings
⢠DCC enabling via EMRS2 setting
⢠All speed grades faster than DDR2â400 comply with
DDR2â400 timing specifications.
⢠All inputs and outputs SSTL_1.8 compatible
⢠Off-Chip Driver Impedance Adjustment (OCD) and On-Die
Termination (ODT)
⢠Serial Presence Detect with E2PROM
⢠SO-DIMM Dimensions (nominal): 30 mm high,
67.60 mm wide
⢠Based on standard reference layouts Raw Card âAâ,
âCâ,âEâ
⢠RoHS compliant products1)
Product Type Speed Code
â2.5F
Speed Grade
Max. Clock Frequency @CL6
@CL5
@CL4
@CL3
Min. RAS-CAS-Delay
Min. Row Precharge Time
Min. Row Active Time
Min. Row Cycle Time
PC2â6400
5â5â5
fCK6
fCK5
fCK4
fCK3
tRCD
tRP
tRAS
tRC
400
400
266
200
12.5
12.5
45
57.5
â2.5
PC2â6400
6â6â6
400
333
266
200
15
15
45
60
â3
PC2â5300
4â4â4
â
333
333
200
12
12
45
57
TABLE 1
Performance Table
â3S
â3.7
Unit
PC2â5300
5â5â5
â
333
266
200
15
15
45
60
PC2â4200
4â4â4
â
266
266
200
15
15
45
60
â
MHz
MHz
MHz
MHz
ns
ns
ns
ns
1) RoHS Compliant Product: Restriction of the use of certain hazardous substances (RoHS) in electrical and electronic equipment as defined
in the directive 2002/95/EC issued by the European Parliament and of the Council of 27 January 2003. These substances include mercury,
lead, cadmium, hexavalent chromium, polybrominated biphenyls and polybrominated biphenyl ethers.
Rev. 1.1, 2007-01
3
08212006-PKYN-2H1B
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